How to create customized Reports of the recorded Product/oven data.
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Step #1: Baseline Profile
The OvenSENTINEL™ System requires a Baseline Profile to be established. To ensure success when monitoring Products with the OvenSENTINEL™ System, it is important that when creating and recording a Baseline Profile (*.XMG) it is properly configured. To complete this process, ECD M.O.L.E.® MAP software is required.
If you have already created M.O.L.E.® MAP thermal profiles that contain these profile settings, proceed to Step #2: Product Creationwhere they can be imported using the Add Product process.
Record Baseline Profile (Data Run)
This Wizard guides the user through a typical process on how to set a M.O.L.E. Profiler up for recording a Baseline Profile (data run).
Set an Reflow Environment. Either open an existing Environment Folder or create a new one.
If the Reflow Environment is not displayed on the Environment Sidebar, the user can use either the Open Environment Toolbar button or select the Open Environment Folder command from the File Menu.
4)
On the M.O.L.E. menu, click Setup Instrument and the workflow wizard appears.
When navigating through the wizard, the step list on the left uses a color key to inform the user of the current step, steps that have been completed and remaining steps.
Current
Completed
Remaining
5)
Select the desired instrument from the dialog box to make active. If there are none listed, click the Scan for Instruments command button to detect all available instruments.
6)
Click the Next command button.
7)
Set instrument name and recording interval.
8)
Click the Next command button.
When using the SuperM.O.L.E.® Gold Profiler, the sending of data erases any currently stored data.
9)
Confirm the assembly information (board size, sensor locations and a product image).
10)
Click the Next command button.
11)
Verify the instrument status. This dialog box displays the health of the M.O.L.E. Profiler such as Power Pack charge, internal temperature, thermocouple temperatures.
If everything is OK, the dialog box displays a GREEN symbol. If there are any items that may prevent the user from collecting good data, they are highlighted and a yellow Warning symbol is displayed.
OK
Warning
12)
Select the Finish command button to complete the Setup Instrument wizard.
13)
Place the M.O.L.E. Profiler in the appropriate thermal barrier making sure the Thermocouple and/or Sensor wires are not damaged.
Never permit the M.O.L.E. Profiler to exceed the absolute maximum warranteed internal temperature, as permanent damage may result. The warranty will not cover damage caused by exceeding the maximum specified internal temperature.
14)
After the oven stabilizes, turn the M.O.L.E. Profiler ON and press the record button.
The record button will need to be pressed even if the M.O.L.E. Profiler is configured to start if the start parameters Trigger Temperature or Points Delay are configured.
15)
Pass the thermally protected M.O.L.E. Profiler and test assembly through the machine.
It is highly recommended that protective gloves are used when retrieving the thermal barrier from the oven and when opening the thermal barrier.
16)
As the test assembly and M.O.L.E. Profiler emerge from the machine, carry the test assembly with sensors attached and the M.O.L.E. Profiler in the Thermal barrier to a table or flat surface.
If a sensor is removed before the M.O.L.E. Profiler has stopped collecting data, the data for that channel might become distorted.
17)
Open the Thermal barrier and if the Activity LED is still flashing this means the M.O.L.E. Profiler is still recording and it must be stopped.
18)
Remove the M.O.L.E. Profiler from the Thermal barrier. Handle it carefully, as the case may still be warm.
19)
Disconnect the sensors from the M.O.L.E. Profiler and place it near the computer.
Read Baseline Profile (Data Run)
The Download Data workflow is a wizard that downloads a recorded Baseline Profile (data run) from the M.O.L.E. Profiler.
If the Reflow Environment is not displayed on the Environment Sidebar, the user can use either the Open Environment Toolbar button or select the Open Environment Folder command from the File Menu.
4)
On the M.O.L.E. menu, click Read Instrument and the workflow wizard appears.
5)
On the Start dialog box, click the Download Data command button and the workflow wizard appears.
When navigating through the wizard, the step list on the left uses a color key to inform the user of the current step, steps that have been completed and remaining steps.
Current
Completed
Remaining
6)
Select the desired instrument from the dialog box to make active. If a M.O.L.E. Profiler has already been selected during a different process, the software automatically selects the M.O.L.E. Profiler connected to the COM Port previously used.
7)
Click the Next command button.
8)
Select the desired Baseline Profile (data run) and then click the Finish command button to complete the wizard and read from the M.O.L.E. Profiler.
9)
When the Baseline Profile (data run) has been downloaded, the software prompts the user to specify new file name (*.XMG).
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10)
When finished, click the Save command button to complete the process.
Visual Tutorial:
Machine Information
This sets machine information that is displayed on the Data Graph so the user can visually see how the Baseline Profile (data run) lines up with the machine.
When setting machine information, this data will be applied to the currently selected data run only.
1)
Activate the M.O.L.E.® MAP software.
2)
On the Machine menu, click Set Machine Information.
3)
Select a machine from the machine drop down list.
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If your machine does not appear in the list, continue to set the machine information and select the Save As command button to save the new machine settings as an (*.XMR) file in the current Environment. This new machine file will appear in the machine drop down list.
4)
Set the machine zone units.
5)
Set the number of all machine zones (heating and cooling).
6)
Set the machine temperature units.
7)
Set the machine conveyor speed and units. The software uses this value to calculate the Time (X) Scale values when Distance units are displayed.
To properly display a machine model on the Data Graph, a conveyor speed must be set.
8)
In the machine zone matrix set:
•Zone names (descriptions)
•Zone lengths (If you do not have zone measurement information, use a tape measure to determine the zone sizes).
•Zone temperatures (top / bottom)
•Zone types (heating or cooling)
9)
Click the OK command button to set the machine information for the displayed thermal profile.
Oven Model Alignment
Oven model alignment accurately reflects how each oven zone influenced the Baseline Profile (data run). All of the KPI measures depend on proper oven model alignment so if it is not, OvenSENTINEL™ recorded data will not be accurate.
If the oven model does not appear on the Data Graph, click Show on Profile from the Machine menu.
There is two primary methods to align the oven model in M.O.L.E.® MAP, align profile peaks and moving the process origin. Both methods need to align the end of the last hottest zone in the oven model with the Data Plot peaks of the Baseline Profile (data run).
Align profile peaks:
If sensors are placed so they enter and exit machine zones at different times, the resulting Data Plots lag behind one another. The Align Profile Peaks command automatically aligns the Time (X) axis maximum peak values for each Data Plot and the end of the last hottest zone in the oven model.
A conveyor speed must be set to properly use this command.
1)
On the Profile menu, click Align Profile Peaks.
The channel lag values are automatically calculated, and the Data Plots adjust to reflect them. A check mark appears to the left of the command indicating the software is in Align Profile Peaks mode.
If a Data Plot in the Data Graph is bad (i.e. open, intermittent or detached thermocouple) it may prevent the oven model to align. Data Plots can be suppressed by clicking the corresponding channel check box in the Data Table. This allows the software to align good Data Plot peaks and the oven model.
Move the Process Origin:
If there is something preventing oven model alignment using Align Profile Peaks, the user can manually adjust the oven model by moving the Process Origin. This is the gray vertical line at the left edge of the oven model that indicates where the assembly process starts. Manually moving the Process Origin may take a couple attempts to align the end of the last hottest zone in the oven model with the Data Plot peaks of the Baseline Profile (data run).
Assembly Information
This sets assembly information associated with the thermal profile.
When setting assembly information, this data will be applied to the currently selected thermal profile only.
1)
Activate the M.O.L.E.® MAP software.
2)
On the Assembly menu, click Set Assembly Information.
3)
Enter an assembly part number.
4)
Click the Notes command button if you would like to enter part documentation about the test assembly being profiled.
5)
Click the image file Browse command button to select a product image. Image files supported by the software are Jpeg (.jpg), Bitmap (.bmp), and Tiff (.tif).
6)
Enter the test assembly board length, width and thickness.
7)
Enter the sensor location descriptions. These descriptions can be the location where each sensor is connected to the test assembly. The channel color associated with the description indicates which Data Plot on the Data Graph it represents.
8)
Enter sensor location dimensions. Sensor Locations can also be set by dragging sensor location markers on the selected image. To move the markers, click the Enlarge command button below the assembly image and the Set Sensor Locations dialog box appears.
X-dimensions are measured from the leading (right) edge or the first edge to enter the process, and Y dimensions are from the top down.
9)
Click the OK command button accept.
KPI (Key Process Indicators)
The KPI Data Table should include various user configured parameter values that are critical to your Baseline Profile (data run). Each column after the Sensor Locations allows the user to define parameters using the M.O.L.E.® MAP Template commands.
This information is saved with the *.XMG file and will be imported when creating a product. If any KPI measures are configured using M.O.L.E.® MAP Time (X) Reference Lines, they will not be imported as they are not supported in OvenSENTINEL™.
The Baseline Profile (*.XMG) can now be imported into OvenSENTINEL™ software. This Baseline Profile (*.XMG) applies to this oven only as any slight difference in the oven and/or process will affect the success of monitoring product.
Step #2: Product Creation
Once a Baseline Profile has been established, it can be used to create a new Product. Each Product defines the requirements for that product, machine properties that achieve those requirements, and the actions you wish to perform if those requirements are not met.
Activate the OvenSENTINEL™ software and select the Product View button.
2)
Select the Add Product button from the Product Manager.
Settings that display an asterisk (*) are required.
3)
On the Add Product window, select MAP Profile or Import OvenSENTINEL™ Product.
•MAP Profile imports an existing (*.XMG) Baseline Profile (data run) specifically for the oven from ECD M.O.L.E.® MAP software. See topic Step #1: Baseline Profile for more information.
•Import OvenSENTINEL™ Product is a copy and tweak process that considerably speeds up the Product creation process. It loads an existing Product created for the oven or an identical oven, and allows the user to modify (tweak) the settings as needed.
This topic covers the more common process of creating a Product from a MAP Profile.
4)
Select the Browse button to navigate to the location of the Baseline Profile (*.XMG) file.
5)
Select the (*.XMG) file and click the Open button. This loads the Baseline Profile data and the KPI calculations established in M.O.L.E.® MAP. It also loads the assembly and machine information.
It is very important that the selected thermal profile (*.XMG) was created on the oven that OvenSENTINEL™ is monitoring. If the selected thermal profile (*.XMG) was not from the same oven, it will be rejected and the user notified of the mismatch.
6)
Enter a Unique Product name in the box. This field is populated with the assembly name from the selected thermal profile (*.XMG). It can be changed however, must remain unique from any existing Product. To assist the user, this box displays a confirmation symbol in addition to a list of currently used Products.
Once a valid profile is loaded, the Profile Shape and Data Table KPI Measures are displayed.
7)
Select the Status of the product.
•Active: When set, this is displayed in the Product list. This is the default for all new Products.
•Inactive: When set, this Product is no longer visible in the Product list, it can be found when using "inactive" on the Product Filter. Products are typically set to inactive when the Product is not likely to be monitored or the user would like to reduce the amount of Products in the list. It can be set to active at anytime by editing the Product.
8)
Select the Configure... button in SPC Options to set the number of sample measurements. This is how many recorded data points (samples) for this Product to be used in SPC Cp; CpK calculations. Refer to Topic Appendix>Statistical Process Control (SPC) Background Information for more information.
This setting can be edited with the Product Manager. Refer to topic Products for more information.
9)
Click the Next button to configure Assembly information.
Assembly
Set or edit assembly information associated with the selected Baseline Profile that was selected for the Product.
This information is imported from the *.XMG file and can be changed/modified.
If you would like to assign or update an identification image, select the Add image button to navigate to the location of the Product image. Image files supported by the software are Jpeg (.jpg), and PNG (.png).
2)
Select the image file and click the Open button.
3)
If you would like to enter or update part documentation about the Product, add Notes to the text box.
4)
Enter or update the Dimensions of the Product.
5)
Click the Next button to configure Machine Settings.
Machine Settings
Set or edit machine information that is used to properly display the Dynamic Profile on the Data Graph when Monitoring.
This information is imported from the *.XMG file and can be changed/modified.
1)
In the machine zone matrix, set or update the zone temperature setpoints (top / bottom).
To enter top and bottom zone temperature with different setpoints, un-select the associated checkbox.
2)
Set or edit the machine conveyor speed and units. The software uses this value to determine the Time (X) Scale for the for the Dynamic Profile during product Monitoring. Refer to Topic Step #3: Monitoring for more information. This must be set to the speed of the conveyor when the Baseline Profile was recorded.
3)
If the oven requires a machine warm up delay prior to Product monitoring, enter the desired time in the Delay text box. When set, this delay starts a countdown timer after the oven has completed the warm up and met the KPI and oven specifications set in the Alerts table. Refer to topic Operation>Step #2: Product Creation>Machine Settings>Alerts for more information.
4)
If you would like to enter or update machine notes about the machine or process, add Notes to the text box.
5)
If you would like to Require User "OK" before Recording Starts, select the check box. If this is set for this Product, a check box is displayed during Product changeover on the notification screen. This requires the user to manually allow the software proceed after all prior product boards have exited the oven and the KPI Spec Confirmation process is complete. Refer to topic Step #3: Monitoring for more information.
6)
Click the Next button to configure Alerts.
Alerts
The user can assign warning and alarm alert limits and the notification actions. The software allow alerts for KPI measurements, oven measurements and Barcodes (if Barcode is configured with the system). If an alert is issued and the selected associated action is executed.
This information is imported from the *.XMG file and can be changed/modified.
Select a desired Warning check box for UWL (upper warning limit), LWL (lower warning limit) and/or CpK limit to activate. Enter a warning limit value for UWL, LWL and/or CpK that warns the operator when the parameters violate these limits. Typically, these values are set a little tighter than the Alarm specification limits so the system can inform the operator that the value is trending toward violating the Alarm specification.
If setting alerts, the software does not require both warnings and alarms to be set for the desired measurement.
KPI Measurement Warnings
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Hardware Measurement Warnings
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The software allows Alerts to be applied to individual channels. Remove the check mark from the Link check box. This expands the list to reveal the individual channels for the KPI Parameter.
2)
Click the Warning Actions button select the desired warning actions Light Tower, Audio , Prevent Recording and/or Email.
•Light Tower warning alert action is always selected, since the included Status Badge always provide a visual alert (Yellow). The light tower is an optional feature.
•Audio warning alert action is available if the optional Light Tower is installed with the system and you wish to have audio alerts.Email warning alert action is available if Mail Configuration is set up for the system and you wish to receive alerts via Email. Refer to topic Software Workspace>Preferences for more information.
3)
Select a desired Alarm check box for USL (upper specification limit) and/or LSL (lower specification limit) to activate. Enter an alarm value for USL and/or LSL. The software monitors the selected measurements and issues an alert if the specification limits are violated.
If the oven has a Barcode, alerts can be set for missing and validation of product barcodes.
KPI Measurement Alarms
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Hardware Measurement Alarms
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Barcode Alarms
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The software allows Alerts to be applied to individual channels. Remove the check mark from the Link check box. This expands the list to reveal the individual channels for the KPI Parameter.
4)
Click the Alarm Actions button to select the desired alarm actions Light Tower, Audio, SMEMA and/or Email.
•Light Tower alarm alert action is always selected, since the included Status Badge always provide a visual alert (Red). The light tower is an optional feature.
•Audio alarm alert action is available if the optional Light Tower is installed with the system and you wish to have audio alerts.
•SMEMA alarm alert action is available if the optional SMEMA Interface is install with the system.
•Email alarm alert action is available if Mail Configuration is set up for the system. Refer to topic Software Workspace>Preferences for more information.
If the optional SMEMA Interface is installed with the system, activating the alert action will signal the SMEMA to open the machine ready circuit. This is intended to stop upstream product from entering the oven.
6)
Click the Next button to add current Probe Temperatures.
Probe Temperatures
This process records the board level thermal conditions of the oven that created the Baseline Profile. These recorded values are then used when monitoring and recording data for the Dynamic Profile which is a predicted profile based on the current temperatures and conveyor speed of the oven and the Baseline Profile.
Prior to Applying Probe Temps, the oven must be at the same conditions as the oven was when the Baseline Profle was recorded. The software allows a temperature variance for each zone since zone temperatures are not always the same at the board level compared to the zone setpoints from the imported (*.XMG).
Click the Apply Probe Temperature button and a dialog box appears displaying the machine setpoints and actual probe temperatures.
2)
If all the zone temperature probe values are within 20°C, the software displays the value in green and a check mark. If you wish to accept, click the OK button record these values.
If any of these values are not met, it is recommended to click the Cancel button, confirm the setpoints are correct and wait for the oven to stabilize at the correct settings.
Step #3: Monitoring
When the OvenSENTINEL™ is monitoring and recording the data, there are three views; Profile, Machine and SPC. The Profile represents a predicted "Dynamic" profile based on the current temperatures. The Machine view displays an animation of the recording process when product (boards) are being processed through the oven. The SPC view shows historical control charts for a selected measurement.
Start Recording
Once or more Products have been properly configured, the user can start monitoring and recording the data for the selected Product.
On the Product Management View, select a Product on the Product Manager.
2)
Select the Start Recording button from the Product Identifier.
3)
Prior to monitoring, the software displays the notification panel. This panel includes the required Machine Settings for the product and an step indicator when initiating the recording process. When the KPI and Oven measurements are in specification, the notification panel auto hides and recording begins.
When the notification panel is displayed, it can be hidden by selecting the Hide Panel button located on the left of the notification panel or selecting the Alerts button.
Hide Panel Button:
Alerts Button:
When the user starts the recording process and one or more KPI and/or oven specifications are not met, the software displays them on the Specification List and the associated symbol in the stabilization step is red. Recording does not start until all measurements are within specification.
Monitoring - Profile View
The Profile View is where the Dynamic Profile is displayed when monitoring.
Select the Profile button to display. When OvenSENTINEL™ is monitoring a Dynamic Profile is displayed which represents a predicted profile based on the current temperatures and conveyor speed in the oven plus the Baseline Profile. The KPI Table includes user configured KPI parameter values imported from the Baseline Profile (*.XMG). Each row in the Table represents the channel sensor data.
Monitoring - Machine View
The Machine View displays an animation of the oven and board tracking.
Select the Machine button to display. The user can view current zone temperatures, zone setpoints, conveyor speed, hardwarre components (barcode, in/out sensors, SMEMA option) and product location. The animation displays boards at the various tracking locations specifically configured for your OvenSENTINEL™ System.
If an individual board is physically removed from the process or is falsely reported, the user can select the red delete cross associated with the board to remove it from the Monitoring process.
Monitoring - SPC View
The SPC view displays TrueProfile™ KPI or Oven values as an Individual or X Bar and R control charts. The user selects the value to chart from a series of drop down boxes that list the available values to display a SPC chart. Refer to Appendix: TrueProfile™ for the full definition.
Before a TrueProfile™ KPI SPC Chart can be displayed, boards must have exited the oven. TrueProfile™ KPI values are recorded individually over time for each board as it passes through the oven.
Select TrueProfile™ or Oven from the drop down box. TrueProfile™ key process indicator parameters (KPI) from the Baseline Profile or Oven measurements captured during the monitoring process is selected.
3)
Select a Measurement from the next drop down box. This box is a list of available TrueProfile™ KPI parameters or Oven measurements.
4)
If selecting a TrueProfile™ KPI Measurement, select a Channel from the next drop down box. This box is a list of available sensor channels from the Baseline profile
5)
Select a Sample and Subgroup size for the TrueProfile™ KPI Measurements or Oven values. Sample size sets the number of measurements displayed on the SPC view when monitoring. The Subgroup samples are averaged to produce each data point on the SPC chart on an Individual or X Bar R control chart.
Monitoring – Auto Changeover
The OvenSENTINEL™ software has the ability to automatically changeover products from one Product to another as the new Product is read by the barcode while current product is completing. To enable this feature, the OvenSENTINEL™ System must be equipped with a barcode reader in addition to each product (boards) having unique a barcode.
To evoke auto changeover, the Product being monitored must be configured to be used in changeover in addition to the Product set to enter the oven. Both Products must also have unique barcodes.
Select the Edit Product button from the Product Manager.
3)
Select Alerts from the Edit Product dialog box.
4)
Select the Barcode Alerts tab.
5)
Select the Validate barcode and Use for changeover check boxes. They both MUST be selected for changeover to be evoked.
6)
Enter a barcode that is associated with the specific Product being edited. Enter by typing in the Criteria text box and selecting the Add symbol. If the Product requires multiple barcodes, repeat this step for each one.
Barcodes can be specified by adding a list, Filter (Prefix, Contains, Suffix) or an Regular expression. To learn, build, & test Regular Expressions (RegEx / RegExp) you can use RegExr which is an online tool. For this example List will be used.
7)
Once the barcode(s) are loaded, select the Done button to save the Product.
8)
Once OvenSENTINEL™ detects a valid barcode associated with a different Product that is configured for auto changeover, the notification panel appears displaying the status of the auto changeover process. If the SMEMA option is configured with the system, it stops additional boards from entering the oven during Product changeover.
When the notification panel is displayed, it can be hidden by selecting the Alerts button. To display select the Alerts button again.
Alerts Button:
Step #4: Reports
The Reports view allows the user to access historical recorded data in report form.
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